SiPh Package Reliability Engineer at Globalfoundries in New York, NY

Job description

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: GlobalFoundries is seeking a Package Reliability Engineer to support reliability methodology development and qualification execution for silicon photonics products and advanced optical packages. The engineer will evaluate reliability across interfaces connecting the photonic chip, optical fiber, package, and associated electrical, thermal, and mechanical elements. The role is responsible for identifying package-level reliability risks, translating product use conditions and customer requirements into test plans and acceptance criteria, supporting physics-of-failure based acceleration models, and executing qualification activities from technology development through manufacturing release. The engineer will work closely with photonics device, package development, assembly, test, product, quality, manufacturing, and customer-facing teams. Essential Responsibilities · Support package-level reliability strategy for silicon photonics products, covering chip-to-package, fiber-to-chip, optical attach, package materials, and relevant electrical and thermal interfaces. · Define qualification requirements, reliability test vehicles, test structures, stress matrices, sample plans, read points, failure criteria, and reporting methods based on product mission profile and customer use conditions. · Identify and prioritize failure mechanisms associated with optical coupling and attach, fiber alignment stability, adhesives and underfills, solder and interconnects, interfaces, moisture sensitivity, thermal cycling, mechanical loading, contamination, and material compatibility. · Develop and apply physics-of-failure methodologies and acceleration models for temperature, humidity, thermal cycling, mechanical stress, optical power, and combined-stress conditions. · Plan and execute package reliability evaluations including temperature cycling, high-temperature storage, biased or unbiased humidity testing, mechanical shock and vibration, fiber pull, optical power aging, and other application-specific stresses. · Correlate optical, electrical, mechanical, thermal, and material characterization data to determine degradation drivers, failure signatures, and lifetime-limiting mechanisms. · Support failure analysis and root-cause investigations with cross-functional teams, recommend corrective actions, and verify effectiveness through targeted experiments. · Provide reliability design guidance and risk assessments during architecture, material selection, package design, process integration, and design-change reviews. · Develop qualification plans and reliability evidence packages that align internal requirements, applicable industry standards, and customer expectations. · Provide technical support for interactions with customers, suppliers, outsourced assembly and test partners, and internal stakeholders on package reliability requirements and issues. · Plan and manage reliability hardware, fixtures, optical and electrical test capability, and external laboratory support needed to meet program schedules. · Analyze reliability data using appropriate statistical methods, including Weibull or lognormal analysis, censored data treatment, degradation modeling, and uncertainty assessment. · Author qualification reports, technical specifications, reliability guidelines, risk assessments, and customer-facing technical summaries. · Share technical knowledge with engineers and technicians and contribute to consistent reliability methods and documentation practices across programs. · Su