Principal Physical Design Engineer at Broadcom in CA San Jose Innovation Drive
- Company: Broadcom
- Location: USA-CA San Jose Innovation Drive
- Salary: $144K – $230K
- Job type: full time
- Workplace: onsite
- Posted: 2026-10-30
Job description
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Principal Physical Design Engineer — ASIC Products Division (APD) Location: San Jose, CA Position Type: Full-Time Who We Are — Physical Design Team in APD Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone. The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting-edge physical design methodologies in 3nm/2nm nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success. What Defines Our Physical Design Team Pioneering First-Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the largest and most complex die sizes from floorplan to tapeout on leading-edge foundry nodes (N7, N5, N3, and N2). Record-Breaking Scale & Complexity: We regularly execute full-chip physical implementation for ultra-large-scale ASICs exceeding tens of billions of transistors, multi-gigahertz clock frequencies, and dense multi-die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures). Methodology & Flow Leadership: We develop and maintain cutting-edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn-around-time (TAT). About the Role Broadcom’s ASIC Products Division (APD) is looking for a Principal Physical Design Engineer to lead physical design implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will drive complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14). Key Responsibilities Full-Flow Implementation: Lead block-level and top-level implementation from floorplanning to GDSII stream-out using Cadence Innovus Advanced Node Execution: Drive floorplanning, placement, CTS, routing, and timing/power optimization on advanced technology nodes (5nm, 3nm, 2nm) using multi-patterning and complex metal stacks. Timing & Power Closure: Perform multi-corner multi-mode (MCMM) static timing analysis (STA), signal integrity (SI) optimization, and power grid optimization (static/dynamic IR-drop, EM) for signoff using PrimeTime, Voltus, or RedHawk. Qualifications & Requirements Education: B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field. Experience: 12+ years of hands-on physical design experience successfully taping out complex high-frequency, ultra-large-scale networking or AI ASICs. Deep Sub-Micron Expertise: Direct experience executing tapeouts in TSMC advanced nodes (N7, N5, N3) or equivalent foundry processes. EDA Tool Mastery: High proficiency in major physical design tool flows: P&R: Cadence Innovus Timing/STA: Synopsys PrimeTime or Cadence Tempus Extraction & IR/EM: StarRC / QRC, RedHawk DRC/LVS: Siemens Calibre Automation Skills: Advanced TCL, Python, and Unix shell scripting for flow automation and database manipulation. Communication: Excellent technical leadership, problem-solving, and cross-functional communication skills. Preferred Qualifications Strong background in high-speed clock network implementation (H-tree, mesh, low-power
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