Physical Design Engineer at Broadcom in CA San Jose Innovation Drive

  • Company: Broadcom
  • Location: USA-CA San Jose Innovation Drive
  • Salary: $83K – $132K
  • Job type: full time
  • Workplace: onsite
  • Posted: 2026-10-30

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Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Physical Design Engineer (New College Grad) — ASIC Products Division (APD) Location: San Jose, CA Position Type: Full-Time Who We Are — Physical Design Team in APD Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone. The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting-edge physical design methodologies in 3nm/2nm/A14 nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success. What Defines Our Physical Design Team Pioneering First-Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the largest and most complex die sizes from floorplan to tapeout on leading-edge foundry nodes (N7, N5, N3, and N2). Record-Breaking Scale & Complexity: We regularly execute full-chip physical implementation for ultra-large-scale ASICs exceeding tens of billions of transistors, multi-gigahertz clock frequencies, and dense multi-die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures). Methodology & Flow Leadership: We develop and maintain cutting-edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn-around-time (TAT). About the Role Broadcom’s ASIC Products Division (APD) is looking for a motivated Physical Design Engineer (NCG) to join our Physical Design team. In this role, you will work alongside experienced engineers in executing the implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will gain hands-on experience in complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14). Key Responsibilities Participate in block-level floorplanning, and run placement and route (P&R) flows using industry-standard EDA tools. Perform Static Timing Analysis (STA), debug timing paths, and execute ECOs for timing closure. Run Physical Verification checks (DRC, LVS, ERC, Antenna) and resolve signoff violations. Analyze IR drop and electromigration (EM) to ensure power grid integrity. Develop and maintain automated scripts (TCL, Python, Ruby) to enhance flow efficiency and productivity Basic Qualifications Education: Bachelor's Degree in Electrical Engineering, Computer Engineering + 2yrs of experience or Master’s degree in Electrical Engineering, Computer Engineering (Graduation date within the past 12 months). Solid understanding of digital CMOS logic design, standard cell libraries, and semiconductor fundamentals. Familiarity with static timing analysis (STA) concepts, clocking, and setup/hold timing. Hands-on coursework, lab experience, or academic projects using EDA design tools (Cadence Innovus/Tempus, Synopsys IC Compiler II/PrimeTime, or Siemens tools). Proficient in scripting languages such as TCL, Python, Ruby, or Bash . Preferred Qualifications Prior internship or research experience in ASIC physical design, synthesis, or physical verification. Basic understanding of Design for Testability (DFT), low-power intent (UPF/CPF), and FinFET technologies. Excellent problem-solving, d

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