(New College Graduate) Engineer, Technology Development Engineering_MH at Sandisk in Fujisawa

Job description

*This is for New College Graduate* Position Overview This new college graduate Device Engineer role focuses on Memory Health and develops engineers who improve customer quality by understanding NAND wafer manufacturing processes, identifying the physical mechanisms of electrical failures, and creating electrical stress and screening methods that detect future failures before product shipment. Essential Duties and Responsibilities Support NAND flash Memory Health activities focused on reducing customer failures and improving defective parts per million (DPPM) through device evaluation, failure analysis, and electrical stress and screening development. Develop an understanding of NAND wafer manufacturing processes and evaluate NAND array and peripheral device behavior using electrical characterization, reliability testing, cycling experiments, and analysis of wafer-, process-, and product-level data. Analyze and identify the physical mechanisms underlying electrical failures by correlating process conditions, electrical signatures, and device behavior through structured, data-driven root-cause analysis. Provide analysis results and actionable feedback to process integration and manufacturing teams to support wafer process improvement and prevention of failure recurrence. Develop and optimize electrical stress and screening conditions to accelerate latent failures and screen affected devices during die sort while maintaining product performance, yield, and test efficiency. Plan, execute, and document experiments using Design of Experiments (DOE), statistical analysis, visualization, and programming languages such as Python to analyze process and electrical data and automate analysis workflows. Work with device, design, process integration, product engineering, test, manufacturing, and reliability teams to provide feedback for process improvement, next-generation design, qualification, and production deployment. Collaborate with Memory Health and engineering teams in Japan and other global locations, and communicate technical results through reviews, reports, and presentations. Learn NAND device technology, wafer manufacturing processes, defect physics, reliability engineering, and production screening practices through hands-on assignments and technical mentoring. REQUIRED M.S. or Ph.D. degree in Electrical Engineering, Applied Physics, Materials Science, Physics, or a related field, completed before the employment start date. New college graduates are encouraged to apply; prior semiconductor industry experience is not required. Academic knowledge of semiconductor device physics and familiarity with semiconductor wafer manufacturing processes, electrical characterization, reliability, failure analysis, or data analysis. NAND flash memory knowledge is a plus, but is not required. Ability to learn new technical concepts, conduct experiments carefully, correlate manufacturing process conditions with electrical failure signatures, analyze data logically, and communicate results clearly with guidance from experienced engineers. Strong analytical and problem-solving skills. Experience using programming languages such as Python for process and electrical data analysis, visualization, statistical analysis, or workflow automation through coursework, research, internship, or project work is preferred. Experience using ML/AI for data analysis, anomaly detection, classification, or modeling is a plus. Strong English communication skills are required. While Japanese proficiency is not required at the time of hire, candidates are expected to actively and independently learn Japanese and aim to achieve effective working-level communication in Japanese within approximately two years. The individual must be self-motivated and self-directed, and must demonstrate the ability to work well with people within and outside the team in a collaborative, global engineering environment. Sandisk thrives on the power and potential of diversity. As a global co