Lead Engineer, Package Development at Allegro MicroSystems in Manila

Job description

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve. The Opportunity The Lead Engineer for Package Development is an experienced professional who takes a leading role in bringing new products from design to production. This role is responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products. Operating with a high degree of autonomy, the Lead Engineer for Package Development is a key contributor to on-time product release and profitability. What You Will Do: Process/Material/Product Development Process Parameter Optimization Recommend alternative materials to reduce costs, enhance quality, and improve manufacturability. Support on material characterization Execute appropriate analysis (Destructive Package Analysis, Failure Analysis, Product Characterization) to aid in in the design and/or resolution of issues for new packaging projects. Improvement of Existing Methods and Conception of New Methods Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality. Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification. Equipment Qualification and Development Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality. Generates and/or reviews equipment specifications and qualification procedures and supporting documents for PAR of new equipment. Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary. Material Development Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability. Product Development Determines machine and process capability for new products. Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported. Cost Reduction and Yield Improvement Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects. Work with PD and NPI on developing strategies for new products. Standardization and Documentation Generates, interprets, and updates process and material specifications and flowcharts for new package projects. Interprets quality inspection criteria and specifications. Prepares technical reports on the results of evaluations and investigations and presents recommended actions. Coordination/Communication of Process Issues for Improved Quality, Manufacturability and Reliability. Coordinates quality, manufacturability, process control and reliability issues with internal and external customers. Facilitates discussion of material and equipment quality and performance issues with supplier/s. What You Will Need: Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering. Subject matter expert with at least 5 years’ experience in a Package Development, New Product Introduction and/or Sustaining role in a semiconductor assembly environment for leadframe and substrate-based packages, including failure modes and failure analysis, covering standard and custom package. Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results. Review and interpret POD and tooling designs and create/recommend effective solutions to achieve design intent. Comprehensive knowledge of downstream and upstream Assembly processes th