Chip Assembly Die Bonding Process Engineer (m/f/d) - 100% at Coherent in Zurich

Job description

Coherent is a global leader in photonics, developing advanced laser, optical and materials technologies that enable semiconductor manufacturing, AI infrastructure, advanced communications and precision industrial applications worldwide. Chip Assembly Die Bonding Process Engineer Join our semiconductor manufacturing team as a Chip Assembly Process Engineer, where you will take ownership of critical chip assembly processes including die bonding, curing, marking, and inspection. This is a hands-on engineering role focused on developing and optimizing manufacturing processes, improving yield and quality, introducing new products into production, and ensuring the reliability of advanced assembly equipment. Working closely with R&D, production, quality, and suppliers, you will play a key role in bringing innovative technologies from development into high-volume manufacturing. What You’ll Be Doing Own and continuously improve chip assembly processes, including die bonding, curing, marking, and inspection. Develop, qualify, and implement die-bonding processes for new product designs and manufacturing requirements. Define inspection methods, acceptance criteria, and equipment qualifications to ensure assembly quality and process control. Analyze process performance, identify root causes of deviations, and implement corrective actions to improve yield, quality, throughput, and cost. Collaborate with R&D to transfer new technologies and products into manufacturing. Take technical responsibility for die-bonding equipment, including hands-on troubleshooting, optimization, and preventive maintenance support. Work closely with equipment suppliers to evaluate, qualify, and introduce new tools and process improvements. Prepare and maintain process documentation, work instructions, and training materials for operators and engineers. Support manufacturing operations in a cleanroom environment and provide technical expertise to production teams. What You’ll Bring Bachelor's or Master's degree in Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Mechatronics, or a related discipline. 1-3 years of hands-on experience in die bonding, semiconductor assembly, or a similar precision manufacturing environment. Strong understanding of manufacturing processes, process control, and quality improvement methodologies. Experience with process troubleshooting, root cause analysis, and data-driven decision making. Knowledge of SPC, DoE, and other structured process improvement tools. Experience working with automated manufacturing equipment and production processes. A hands-on approach with a passion for solving technical challenges and working directly with manufacturing equipment. Strong collaboration and communication skills, with the ability to work effectively across engineering, production, and supplier teams. Excellent English communication skills. German language skills are beneficial but not essential. Experience in a cleanroom environment, programming, equipment software, soldering processes, or Lean Six Sigma methodologies would be advantageous. Why Join Us Work on advanced semiconductor manufacturing technologies in a highly technical environment. Take ownership of both process development and production equipment. Collaborate closely with R&D to bring innovative products into production. Be part of an international team that values technical excellence, continuous improvement, and professional growth. Competitive salary, comprehensive benefits, and long-term career development opportunities. What We Offer Our benefits vary by country and role. Depending on your location, your package may include: Competitive base salary and annual incentive eligibility Employer-supported pension or retirement provision Health, wellbeing and employee-assistance programmes Life and income-protection benefits Flexible-working arrangements, where compatible with the role Learning and professional-development opportunities Employee recognition a