Advanced Packaging Process Engineer at Intel in Phoenix, AZ

Job description

Job Details: Job Description: Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference. We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world. Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry. Key Responsibilities: Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments. Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement. Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability. Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches. Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards. Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents. Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites. As a Successful Candidate, You Will Bring: Intellectual curiosity — a genuine passion for understanding how things work and a drive to continuously learn and improve. Collaborative spirit — the willingness to work effectively with diverse, cross-functional teams and build strong working relationships. Resilience and adaptability — comfort navigating ambiguity and the skills to pivot quickly when challenges arise. Clear communication — the skills to translate complex technical findings into clear, actionable insights for a variety of audiences. Ownership mindset — a proactive approach to taking responsibility for outcomes and driving projects to completion. Creative problem-solving — the skills to think outside the box and develop innovative solutions to complex engineering challenges. Are you ready to take the next step in your career and be part of a team that is shaping the future of technology? Apply today and join Intel's Oregon team, where your expertise and passion will directly influence the world's most advanced semiconductor manufacturing processes. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship. Minimum Qualifications: Ma